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The Production Operation (Wire Bonding) Level III course by TESDA is specifically designed to meet the high standards of the semiconductor industry. This program aims to equip learners with essential skills in handling critical processes that ensure quality and efficiency in wire bonding operations. Participants will gain practical expertise in evaluating the setup and buy-off procedures of wire bond machines, performing thorough document checks, and conducting precise wire bonding tasks. Additionally, the course emphasizes managing lot transactions, which are vital for maintaining streamlined production workflows.

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This program is instrumental for individuals aspiring to excel in semiconductor manufacturing, where precision and technical excellence are non-negotiable. By mastering the competencies covered in the course, learners will develop the proficiency needed to handle complex production challenges with confidence. Whether you are entering the field or looking to enhance your existing skills, this TESDA program provides a solid foundation for advancing in wire bonding operations while contributing to the dynamic and fast-evolving semiconductor industry.

Course Description

This course trains individuals in advanced wire bonding operations for the semiconductor industry. It covers evaluating and buying off wire bond machine set-ups, checking production documents, performing wire bonding processes, and handling lot transactions. Trainees will gain the skills needed to ensure quality, accuracy, and efficiency in a cleanroom production environment.

Benefits

The Production Operation (Saw Wafers) Level III course offered by TESDA is designed to equip individuals with the essential skills and knowledge required in the semiconductor and electronics manufacturing industry. This specialized training focuses on the critical processes involved in wafer sawing—a vital stage in semiconductor production where silicon wafers are precisely cut into individual chips. Learners are trained to perform key tasks such as verifying apparel and safety compliance, conducting housekeeping procedures, and checking material data against process traveler cards to ensure production accuracy and quality.

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In addition to foundational checks, the course emphasizes hands-on competencies in evaluating machine setup, executing the wafer sawing process, and performing cleaning and inspection of the sawn wafers. These procedures are crucial in maintaining the integrity and functionality of the final semiconductor products. With this training, learners are prepared to meet the demands of a high-tech manufacturing environment, ensuring efficiency, safety, and high-quality output in wafer production operations.

Course Description

This course by TESDA provides trainees with the practical skills and safety protocols needed to operate wafer‐sawing equipment in a semiconductor fabrication environment. Participants learn to verify apparel and housekeeping standards, cross‐check process traveler cards against actual materials, set up and buy off wafer saw machinery, execute precise sawing and cleaning procedures, and perform detailed quality inspections of the cut wafers—ensuring both production efficiency and product integrity.

Benefits

Here are several key benefits of taking the Production Operation (Saw Wafers) Level III course by TESDA:

• Industry-Relevant Skills – Gain hands-on training in wafer sawing operations, a critical process in semiconductor manufacturing, increasing employability in the electronics industry.
• Workplace Safety Awareness – Learn proper use of personal protective equipment (PPE), housekeeping practices, and safety protocols essential for cleanroom environments.
• Quality Assurance Competence – Develop the ability to inspect and assess the quality of sawn wafers, helping ensure high standards in production output.
• Improved Accuracy and Efficiency – Master checking procedures and machine set-up processes, leading to reduced errors and enhanced operational productivity.
• Job Readiness and Career Advancement – Acquire TESDA certification that can serve as a recognized credential for employment or promotion in semiconductor and electronics manufacturing firms.
• Adaptability to High-Tech Environments – Build confidence and capability to work with precision tools and automated systems used in modern production lines.
• Compliance with Industry Standards – Understand and follow standard operating procedures (SOPs) aligned with global manufacturing practices.

Units of Competency

The Units of Competency comprising this Qualification include the following:

BASIC COMPETENCIES

• Lead workplace communication
• Lead small teams
• Apply critical thinking and problem-solving techniques in the workplace
• Work in a diverse environment
• Propose methods of applying learning and innovation in the organization
• Use information systematically
• Evaluate occupational safety and health work practices
• Evaluate environmental work practices
• Facilitate entrepreneurial skills for micro-small-medium enterprises (MSMEs)

COMMON COMPETENCIES

• Use hand tools
• Apply quality standards
• Perform computer operations

CORE COMPETENCIES

• Check apparel requirements, safety, and housekeeping
• Check data in the process traveler card vs actual materials
• Evaluate set-up and buy-off wafer sawing
• Perform wafer sawing and cleaning
• Perform sawn wafer quality inspection

Sample of Certificate of Completion

Job Opportunity

A person with this qualification is qualified to work as a Production Operator in Saw Dicing/Sawing.

Requirements

To enroll, you will need the following documents:

• PSA Birth Certificate
• High School or College Diploma
• Certified True Copy of Official Transcript of Records or Form 137
• Certificate of Good Moral Character or GMRC
• 1 x 1 and/or 2 x 2 pictures

To obtain further details, please reach out to the enrollment site that aligns with your requirements. Kindly note that the criteria may vary.

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Summary

The Production Operation (Saw Wafers) Level III course by TESDA is a specialized training program designed to prepare individuals for roles in the semiconductor and electronics manufacturing industry, particularly in wafer sawing operations. It covers essential competencies such as safety and housekeeping, machine setup and buy-off, wafer sawing and cleaning, and quality inspection of sawn wafers. Trainees also develop basic, common, and core skills, including team leadership, problem-solving, and the use of tools and computer systems. Graduates of the course are qualified to work as Production Operators in Saw Dicing/Sawing and benefit from improved job readiness, industry-recognized certification, and enhanced skills for high-tech environments. Enrollment requires standard documents such as a PSA birth certificate, school records, and ID photos.