The Production Operation (Diet Attach) Level III course offered by TESDA is designed to equip learners with the essential skills and knowledge needed to perform advanced tasks in semiconductor manufacturing, specifically in the die attach process. This training program focuses on competencies such as document verification, interpreting assembly diagrams (AD), epoxy thawing, die attach set-up and buy-off evaluation, actual die attach operation, oven curing, and parameter monitoring. These procedures are vital for ensuring precision, quality, and efficiency in the microelectronics industry.
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By mastering these core skills, trainees are prepared to handle critical production roles with accuracy and accountability. The course emphasizes adherence to industry standards and safety protocols, helping learners become competent professionals capable of contributing to high-reliability semiconductor production lines. Through hands-on training and assessment, participants gain both technical proficiency and a deeper understanding of the die attach process, a key step in ensuring the functionality and durability of electronic devices.
Course Description
This course is a specialized training program that equips learners with the essential skills to perform advanced tasks in the semiconductor manufacturing process. It covers key competencies such as document and assembly diagram checking, epoxy thawing, equipment set-up and evaluation, die attach operation, oven curing, and process parameter monitoring, ensuring quality and precision in every step.
Benefits
Here are several benefits of taking the Production Operation (Die Attach) Level III course:
- Industry-Relevant Skills – Gain hands-on training in specialized semiconductor processes, making you job-ready for roles in electronics and microchip manufacturing.
- Enhanced Employability – TESDA certification is recognized by many local and international companies, improving your chances of employment in high-tech industries.
- Career Advancement – Mastering advanced die attach techniques can lead to higher-level technical positions and greater responsibilities in the production line.
- Quality and Safety Awareness – Learn to uphold industry standards for quality control and workplace safety, which are critical in cleanroom and precision-based environments.
- Productivity and Efficiency – Develop competencies that contribute to faster, more accurate production, benefiting both employees and employers.
- Certification of Competency – Receive a nationally accredited certificate that validates your skills and knowledge in die attach operations.
- Pathway to Further Training – Serves as a foundation for more advanced technical courses or specialized fields within semiconductor and electronics manufacturing.
Units of Competency
The Units of Competency comprising this Qualification include the following:
BASIC COMPETENCIES
- Lead workplace communication
- Lead small teams
- Apply critical thinking and problem solving techniques in the workplace
- Work in a diverse environment
- Propose methods of applying learning and innovation in the organization
- Use information systematically
- Evaluate occupational safety and health work practices
- Evaluate environmental work practices
- Facilitate entrepreneurial skills for micro-small-medium enterprises (MSMEs)
COMMON COMPETENCIES
- Use hand tools
- Apply quality standards
- Perform computer operations
CORE COMPETENCIES
- Perform document checking
- Check the assembly diagram (AD) requirements
- Conduct epoxy thawing
- Evaluate set-up and buy-off of die attach
- Perform die attach
- Perform oven curing
- Conduct parameter monitoring
Sample of Certificate of Completion
Job Opportunity
A person who has achieved this qualification is competent to work as a Production Operator (Die Attaching).
Requirements
To enroll, you will need the following documents:
- PSA Birth Certificate
- High School or College Diploma
- Certified True Copy of Official Transcript of Records or Form 137
- Certificate of Good Moral Character or GMRC
- 1 x 1 and/or 2 x 2 pictures
To obtain further details, please reach out to the enrollment site that aligns with your requirements. Kindly note that the criteria may vary.
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Summary
The Production Operation (Die Attach) Level III course offered by TESDA is a specialized training program designed to equip learners with advanced skills in semiconductor manufacturing, focusing on die attach processes. It covers key competencies such as document checking, assembly diagram interpretation, epoxy thawing, equipment set-up and evaluation, die attach operation, oven curing, and parameter monitoring. The course also includes essential basic and common competencies like team leadership, workplace safety, and the use of hand tools and computers. Graduates receive a nationally recognized certification, enhancing their employability and career prospects in the electronics industry, particularly as Production Operators in die attaching. To enroll, applicants must submit documents such as a PSA birth certificate, school credentials, and ID photos, with specific requirements varying by training center.